P74009/ZF 型红外焦平面探测器自动粘片机
P74009/ZF Infrared Focal Plane Detector Automatic Die Bonder
| 玻璃基板尺寸 Glass base plate size | 3″/4″/6″，厚度 thickness 4mm～7mm |
| 晶片材料 Crystal chip material | 碲锌镉、锑化铟 CdZnTe、 InSn |
| 晶片尺寸 Crystal chip size | 规则晶片 Regular crystal chip 3×10mm（Min）80×80mm（Max） 不规则晶片 Irregular crystal chip（圆弧直径 Arc diameter）≤120mm |
| 加热温度 Heating temperature | 25℃～80℃（可定可调 adjustable） |
| 陪边 Edge | 规则晶片要有陪边： 4 条，宽度 4mm The regular crystal chip with edges: 4, thickness 4mm |
| 陪边要求 Edge requirement | 100 倍放大镜检测下人工辅助完成无明显缝隙拼接 Accomplish no obvious gap splicing manually under the test by 100 times magnifying glass |
| 用途：自动粘片机主要用于碲锌镉、锑化铟等红外器件晶片的自动粘接。 Application: the automatic die bonder is mainly used to bond CdZnTe and InSn Infrared crystal chip automatically. |
| 晶片上表面与基板上表面平行，允差≤2µm（晶片与基板自身平面度≤2µm） The crystal chip surface is parallel with the base plate surface. Tolerance≤2µm (Flatness of the crystal chip and the base plate ≤2µm) |
| 粘接完固化采用常温自然冷却 solidification after bonding uses natural cooling in normal temperature |
| 设备组成：设备由底座、上料机构、抓取机构、滴蜡机构、旋转载片台、挤压机构、下料机构、三维平台、大理石台面、放料工位、防护门罩和电气控制系统等组成。 The equipment composition: the base, material feeding mechanism, grab mechanism, wax dripping mechanism, rotary chip stage, extruding mechanism, unloading mechanism, 3D platform, marble table, material discharging position, protection door cover and electrical control system etc. |